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Huaswin Electronics Co.,Limited
Huaswin Electronics Co.,Limited Rigid PCB, Flexible PCB, Rigid Flex PCB, PCB Assembly, SMT / Through hole Assembly, custom cable assembly manufacturer in China
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Custom SMT BGA PCB Printed Circuit Board Assembly AOI Testing

Huaswin Electronics Co.,Limited
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Custom SMT BGA PCB Printed Circuit Board Assembly AOI Testing

Brand Name : HUASWIN

Model Number : HSPCBA1046

Certification : ISO/UL/RoHS

Place of Origin : China

MOQ : 1 sets

Price : Negotiation

Payment Terms : T/T, Western Union, L/C

Supply Ability : 10,000pcs per month

Delivery Time : 15-20 working days

Packaging Details : Anti-static bag + Anti-static bubble wrap + Good quality carton box

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Custom SMT BGA PCB Printed Circuit Board Assembly AOI Testing

 

 

Specifications

 

1. PCB design & fabrication 

2. Material Sourcing Service
3. SMD assembly and Through hole components insertion
4. IC pre-programming / Burning on-line
5. Function testing as requested
6. Complete Unit assembly ( which including plastics, metal box, Coil, cable inside etc)
7. Packing design

 

Our advanced equipment, process flows in SMT, DIP assembly and high Standard Operation Procedure (SOP) are the fundamental assurance of providing high quality assembly service. The excellent soldering skills to our experienced employee on the production line, and the comfortable clean working environment ensures the quality of our strong processing capacity.

 

All of our products are produced under strictly observation of the ISO9001: 2000 and conform to the ROHS standard. We always take customer's satisfaction as our principle pursuit, " Good quality with reasonable price", "Quick delivery".

 

 

PCB Assembly services: 

 

SMT Assembly 


Automatic Pick & Place 
Component Placement as Small as 0201 
Fine Pitch QEP - BGA 
Automatic Optical Inspection 

Through-hole Assembly 


Wave Soldering 
Hand Assembly and Soldering 

Material Sourcing 
IC pre-programming / Burning on-line 

Function testing as requested 

Aging test for LED and Power boards

Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc) 
Packing design

 

 

Testing Methods

AOI Testing
Checks for solder paste 
Checks for components down to 0201" 
Checks for missing components, offset, incorrect parts, polarity

X-Ray Inspection
X-Ray provides high-resolution inspection of: 
BGAs 
Bare boards 

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by 

component problems. 
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing

 

 

Design file format:
 
1. Gerber RS-274X, 274D, Eagle and AutoCAD's DXF, DWG
2. BOM (bill of materials)
3. Pick and place file (XYRS)
 

 

Advantages:
 
1. Turnkey manufacturing or quick-turn prototypes
2. Board-level assembly or complete system integration
3. Low-volume or mixed-technology assembly for PCBA
4. Even consignment production
5. Supported capabilities 


Product Tags:

printed circuits assembly

      

through hole assembly

      
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